Intel just state that you apply a blob in the center and let the pressure of the warmth sink distribute it. I usually supply a link to Central processing unitproducer, Intel'h, website where they explain how to use TIM.
I possess been doing this since the early 1980's i9000 and possess never found the amount of TlM(thermal interface material/compound/grease/paste) I make use of to cause any complications.
They also do not read the complete article with its comments.
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